Method for stabilizing a tunnel junction component and a...

Details Method for stabilizing a tunnel junction component and a... Method for stabilizing a tunnel junction component and a...

H - Electricity

01

L

H01L 45/00 (2006.01) H01L 29/76 (2006.01) H01L 39/22 (2006.01) H01L 39/24 (2006.01)

Patent

CA 2394116

A method for stabilizing a tunnel junction component, in which a mask is formed on the surface of a substrate, and conductors (3, 4) are constructed by evaporation onto the substrate in an evaporation chamber, and at least one thin oxide layer element (5) is oxidized on top of a selected conductor (3). This remains partly under the following conductor (4), thus forming a tunnel junction element (2) with those conductors (3, 4), and titanium (Ti) or another gettering substance is evaporated on top of the said following conductor (4), before the tunnel junction component is removed from the evaporation chamber, when the titanium layer (7) thus created protects the tunnel junction element (2) from the detrimental effects of air molecules.

L'invention porte sur un procédé de stabilisation d'un composant de jonction à effet tunnel, procédé selon lequel un masque est formé sur la surface d'un substrat et des conducteurs (3, 4) sont créés par évaporation sur le substrat dans une chambre d'évaporation, et au moins un élément (5) d'une fine couche d'oxyde est oxydé au-dessus d'un conducteur (3) sélectionné. Cette oxydation ne remonte pas au conducteur de la couche supérieure, ce qui permet de former avec ces conducteurs (3, 4) un élément (2) de jonction à effet tunnel, et on provoque l'évaporation du titane (Ti) ou d'une autre substance de piégeage sur le conducteur (4). Puis on retire de la chambre d'évaporation le composant de jonction à effet tunnel. Il en résulte que la couche de titane formée vient protéger l'élément (2) de jonction à effet tunnel des effets délétères des molécules d'air.

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