B - Operations – Transporting – 21 – C
Patent
B - Operations, Transporting
21
C
205/29
B21C 1/00 (2006.01)
Patent
CA 1146122
79SC64 ABSTRACT OF THE DISCLOSURE A method is provided for eliminating internal voids in superplastically forming parts. A blank of material which is capable of being formed superplastically is held opposite a forming surface of a die. The blank is heated to the superplastic forming temperature and pressure is applied to both sides of the blank. This pressure is suf- ficient to prevent the formation of voids. The pressure on the side of the blank farthest from the die surface is then increased to superplas- tically form the material against the die surface. In a second embodi- ment, the pressure is applied after the blank has been formed either by maintaining the forming pressure to compress the material between the forming pressure and the reaction of the die, or by applying a fluid pressure to both sides of the part, thereby removing voids by plastic deformation and diffusion.
379729
Ridout & Maybee Llp
Rockwell International Corporation
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