Method for texturing silicon surfaces and wafers thereof

Details Method for texturing silicon surfaces and wafers thereof Method for texturing silicon surfaces and wafers thereof

H - Electricity

01

L

H01L 31/0236 (2006.01) C25F 3/12 (2006.01) H01L 21/306 (2006.01) H01L 21/3063 (2006.01) H01L 31/18 (2006.01)

Patent

CA 2718397

This invention relates to a method for texturing a silicon surface and silicon wafers made by the method, where the method comprises immersing the wafers in an alkaline solution at pH > 10, and applying a potential difference between the wafer and a platinum electrode in the electrolyte in the range of + 10 to + 85 V.

La présente invention concerne un procédé pour texturer une surface de silicium et des plaquettes de silicium produites par le procédé. Le procédé comprend limmersion des plaquettes dans une solution alcaline ayant un pH > 10 et lapplication dune différence de potentiel entre la plaquette et une électrode en platine dans lélectrolyte se situant dans la plage de + 10 à + 85 V.

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