Method for the manufacture of a leadless substrate

Details Method for the manufacture of a leadless substrate Method for the manufacture of a leadless substrate

B - Operations, Transporting

23

K

B23K 35/00 (2006.01) B32B 15/01 (2006.01) H01L 23/495 (2006.01)

Patent

CA 2293628

The invention relates to a method for producing a lead-free substrate comprising a base body made of copper or of a copper alloy, a soldered layer which is applied on at least one part of the base body and which is made of metals from the group gold, gold alloy, silver, silver alloy, palladium and palladium alloy. Said substrate also comprises an intermediate layer which is made of nickel or of a nickel alloy and which is arranged between the base body and the soldered layer. The invention provides an economical method for producing a lead-free substrate with which a wetting time less than one second is obtained after hardening according to DIN EN 60068-2-2 by forming the soldered layer out of at least two individual layers made of different metals and by electrodepositing the intermediate layer and the individual layers.

L'invention concerne un procédé de production d'un substrat exempt de plomb, comportant un corps de base en cuivre ou en alliage de cuivre, une couche de soudure appliquée sur au moins une partie du corps de base, constituée de métaux du groupe or, alliage d'or, argent, alliage d'argent, palladium et alliage de palladium, et une couche intermédiaire, placée entre le corps de base et la couche de soudure, constituée de nickel ou d'alliage de nickel. On obtient un procédé bon marché de production d'un substrat exempt de plomb, avec lequel le temps de mouillage, après durcissement par précipitation selon DIN EN 60068-2-2, est inférieur à 1 seconde, étant donné que la couche de soudure est constituée d'au moins deux couches individuelles de métaux différents et que la couche intermédiaire et lesdites couches individuelles sont déposées par galvanoplastie.

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