Method for the manufacture of waferboard

Details Method for the manufacture of waferboard Method for the manufacture of waferboard

B - Operations, Transporting

29

C

B29C 33/58 (2006.01) B05D 5/08 (2006.01) B27N 1/00 (2006.01) B27N 3/08 (2006.01) D04H 1/00 (2006.01)

Patent

CA 2125316

METHOD FOR THE MANUFACTURE OF WAFERBOARD ABSTRACT OF THE DISCLOSURE A method for applying release agent to wood material and binder used in the manufacture of chipboard. An aqueous solution of the release agent is foamed to form a coherent foam blanket that is applied to the wood material and binder. The foam leaves a coating of release agent on the wood material and binder that enhances release of a platen from the same. Foaming the release agent avoids deleterious aerosolization and increases the efficiency of applying the release agent.

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