H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/24 (2006.01) H05K 1/16 (2006.01)
Patent
CA 2554113
A circuit board element (11) and production thereof are disclosed, whereby a noble metal (16) is applied to a structured conductor layer (13) on a circuit board substrate (12), comprising said conductor layer (13). The conductor layer (13) is roughened on the surface, preferably after the structuring thereof and the noble metal applied as a layer (16), essentially on all of the structured roughened conductor layer (13), whereupon the noble metal layer surface is given a corresponding roughness (8').
L'invention concerne un élément (11) de carte de circuits imprimés et son procédé de fabrication, lequel procédé consiste à structurer la couche conductrice (13) d'un substrat (12) de carte de circuits imprimés, pourvu d'au moins une couche conductrice (13), et à appliquer un métal précieux (16) sur ladite couche. Selon ladite invention, cette couche conductrice (13) est rendue rugueuse en surface, de préférence après la structuration, et le métal précieux est appliqué en couche (16) sensiblement sur l'ensemble de la couche conductrice (13) structurée et rendue rugueuse, la surface de la couche de métal précieux obtenant une rugosité correspondante (8').
Bauer Wolfgang
Stahr Johannes
At & S. Austria Technologie & Systemtechnik Aktiengesellschaft
Bereskin & Parr Llp/s.e.n.c.r.l.,s.r.l.
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