B - Operations – Transporting – 27 – N
Patent
B - Operations, Transporting
27
N
B27N 1/00 (2006.01)
Patent
CA 2657709
A method for the production of material plates made of chip- or fiber material, in particular of chipboard, LDF board, MDF board, HDF board, and OSB board, encompasses the steps: Provision (S2) of dried chip- or fiber material, Plasma treatment (S3a, S3b) of the dried chip- or fiber material, Application of glue (S4a, S4b) to the plasma treated chip- or fiber material, and Compression (S5) of the chip- or fiber material that has glue applied into material plates. The invention also relates to such a material plate.
Procédé de fabrication de panneaux de matériaux en copeaux ou en fibres, en particulier de panneaux d'agglomérés, de panneaux faible densité (LDF), de panneaux moyenne densité (MDF), de panneaux haute densité (HDF) et de panneaux OSB, comprenant les étapes suivantes : approvisionnement (S2) en copeaux ou en fibres séchés, traitement au plasma (S3a, S3b) des copeaux ou fibres séchés, collage (S4a, S4b) des copeaux ou fibres traités au plasma et compression (S5) des copeaux ou fibres collés pour former des panneaux de matériaux. L'invention concerne également un panneau de matériaux de ce type.
Interglarion Limited
Ogilvy Renault Llp/s.e.n.c.r.l.,s.r.l.
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