H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/10 (2006.01) H05K 3/42 (2006.01) H05K 3/46 (2006.01) H05K 1/00 (2006.01) H05K 3/24 (2006.01) H05K 3/40 (2006.01)
Patent
CA 2109687
Electrical connections in multilayer printed circuit boards made from conduc- tor foils are preworked by producing preworked electrical connections on the conductor foils to be subsequently processed and for this purpose photoresist is laminated onto said conductor foils, in such a way that in a photochemical process a freely selectable pattern of recesses in the photoresist is exposed and developed, that in a galvanic plating process metal is plated in said reces-ses and the photoresist is subsequently removed, that at least two conductor foils are pressed, in such a way that the conductor foils are separated by at least one intermediate adhesive film or foil and that each adhesive foil is laminated onto at least one conductor foil, each of said intermediate adhesive foils engaging on at least one conductor foil with preworked electrical con- nections in such a way that on pressing at least two conductor foils the elec- trical connections preworked on at least one of the conductor foils penetrates the intermediate adhesive foil and electrical connections are formed between said conductor foils.
Dyconex Patente Ag
Ridout & Maybee Llp
LandOfFree
Method for the through plating of conductor foils does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for the through plating of conductor foils, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for the through plating of conductor foils will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1670928