Method for treating a polyimide surface for subsequent...

Details Method for treating a polyimide surface for subsequent... Method for treating a polyimide surface for subsequent...

C - Chemistry, Metallurgy

08

J

18/1184, 117/90.

C08J 7/14 (2006.01) B05D 3/10 (2006.01) B05D 7/02 (2006.01) C08G 73/10 (2006.01) C08J 7/02 (2006.01) C08J 7/12 (2006.01) C23C 18/22 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2031110

RD-19,558 METHOD FOR TREATING A POLYIMIDE SURFACE FOR SUBSEQUENT PLATING THEREON Abstract of the Disclosure A polyimide surface is pretreated in preparation for an adhesion promotion treatment and subsequent metallization on the surface, wherein the pretreatment comprises the steps of: (A) contacting the polyimide surface with an aqueous solution of nitric acid having a concentration of about 35 to about 70% by weight or an aqueous solution of hydrochloric acid having a concentration of about 10 to about 38% by weight; (B) rinsing the acid-treated polyimide surface with water so as to substantially remove the acid from the surface of the polyimide; (C) contacting the rinsed polyimide surface with a mild etching agent, resulting in the formation of a residual film on the polyimide surface; (D) contacting the etched polyimide surface with a basic solution, and (E) removing the residual film formed on the surface of the polyimide after contact with the mild etching agent in step (C). The method of this invention allows both filled and unfilled polyimide substrates to be electroless plated in a consistent manner and provides improved adhesion between the polymer and subsequently deposited metals.

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