Method for treating polyetherimide substrates and articles...

Details Method for treating polyetherimide substrates and articles... Method for treating polyetherimide substrates and articles...

C - Chemistry, Metallurgy

08

J

18/1184, 117/80

C08J 7/14 (2006.01) C23C 18/24 (2006.01) C23C 18/38 (2006.01)

Patent

CA 2033934

The method is provided for treating the surface of a polyetherimide substrate to improve its adhesion characteristics for electrolessly deposited metal, such as copper. There is employed a series of surface treatments including the initial immersion of the polyetherimide substrate in sulfuric acid, contact with aqueous base, such as potassium hydroxide, followed by oxidation with an alkali metal permanganate such as potassium permanganate, and surface treatment with a reducing agent, such as a hydroxylamine salt. Polyetherimide metal composites are also provided.

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