Method for use in brazing an interconnect pin to a...

Details Method for use in brazing an interconnect pin to a... Method for use in brazing an interconnect pin to a...

H - Electricity

01

L

356/134

H01L 27/00 (2006.01) H01L 21/48 (2006.01) H01L 21/70 (2006.01)

Patent

CA 1236930

A METHOD FOR USE IN BRAZING AN INTERCONNECT PIN TO A METALLIZATION PATTERN SITUATED ON A BRITTLE DIELECTRIC SUBSTRATE Abstract A method for use in brazing an interconnect pin to a portion of metallization pattern (e.g. a pad) existing on a brittle dielectric substrate, such as a multi-layered ceramic (MLC) substrate, is disclosed. A dielectric layer is formed with appropriate annular openings. Each opening provides a closed containment wall, which extends around and above the pad, to hold the brazing alloy. Each circular containment wall is concentrically aligned with its associated pad and exposes an area, of each pad, having a smaller diameter than that of the entire pad. The containment walls serve to prevent the brazing alloy from coming into contact with any edge of the pads.

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