Method for use of preflux, printed wiring board, and method...

Details Method for use of preflux, printed wiring board, and method... Method for use of preflux, printed wiring board, and method...

B - Operations, Transporting

23

K

B23K 35/365 (2006.01) B23K 35/36 (2006.01) B23K 35/363 (2006.01) C23F 11/14 (2006.01) H05K 3/28 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2068761

Disclosed is a method for the production of a printed wiring board by applying a preflux containing an imidazole compound of the following formula: (see fig. I) (wherein R1 is H or a C1-C17 alkyl group, R2 is H or a C1-C6 alkyl group and n is an integer of 0 to 3) or the formula: (see fig. II) (wherein R3 is H or a C1-C6 alkyl group, R4 is H or a C1-C6 alkyl group, R5 is a bond or a C1-C7 alkylene group and n is an integer of 0 to 3) to a printed wiring board on which circuits are to be formed and then oxidizing the imidazole compound on the printed wiring board. By this way, heatproofness and chemical resistance of the preflux are improved.

L'invention porte sur une méthode pour la production de câblages imprimés par application d'un préflux renfermant un dérivé de l'imidazole de formule (voir fig. I) - où R1 est H ou un alkyle C1-C17, R2 est H ou un alkyle C1-C6, et n est un entier de 0 à 3) - ou de formule (voir fig. II) - où R3 est H ou un alkyle C1-C6, R4 est H ou un alkyle C1-C6, R5 est une liaison ou un alkylène C1-C7, et n est un entier de 0 à 3 - sur un câblage imprimé pour la formation de circuits, puis par oxydation du dérivé de l'imidazole sur le câblage imprimé. De cette façon, on améliore la résistance thermique et chimique du préflux.

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