Method in manufacturing of circuit boards

Details Method in manufacturing of circuit boards Method in manufacturing of circuit boards

H - Electricity

05

K

H05K 3/46 (2006.01) H05K 3/02 (2006.01) H05K 3/10 (2006.01)

Patent

CA 2690198

Method for connecting the conductive surfaces of circuit boards, especially a circuit board equipped with at least two conductive surfaces separated by an insulator layer and with holes, or for creating conductors on a board in a manner that conducts electricity. In the method, a metal or metal alloy, in a powder form, is fed into and the powder is sintered using a laser in order to create a unified conductive structure.

L'invention concerne un procédé pour connecter les surfaces conductrices de cartes de circuit imprimé, notamment une carte de circuit imprimé équipée d'au moins deux surfaces conductrices séparées par une couche isolante et de trous, ou pour créer des conducteurs d'électricité sur une carte. Dans le procédé, un apport de métal ou d'alliage métallique en poudre est utilisé et la poudre est frittée à l'aide d'un laser afin de créer une structure conductrice homogène.

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