Method of ablating a surface layer of a wall, and associated...

B - Operations – Transporting – 08 – B

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B08B 7/00 (2006.01) B23K 26/08 (2006.01)

Patent

CA 2744371

The invention relates to a method of ablating a surface layer (2) of a wall (P) by sweeping the said layer (2), comprising: a step (Ecom) of directional control by an optical deflector (5) of a plurality of pulsed laser beams (7); a step (Eab) of ablating the layer (2) on impact zones (ILC) created by the plurality of laser beams, each impact zone (ILC) being defined by a centre (C) and by a characteristic dimension (d1, d2, d3); the method is characterized in that the impact zones (ILC) are disjoint, the distance (DI) between each centre (C) of the impact zones (ILC) being equal to at least ten times the largest characteristic dimension (d1, d2, d3) of the impact zones. The invention also relates to a corresponding device.

L'invention concerne un procédé d'ablation d'une couche superficielle (2) d'une paroi (P) par balayage de ladite couche (2), comprenant : une étape (E com) de commande directionnelle par un déflecteur (5) optique d'une pluralité de faisceaux laser (7) puisés; une étape (E ab) d'ablation de la couche (2) sur des zones d'impacts (I LC) créées par la pluralité de faisceaux laser, chaque zone d'impact (I LC) étant définie par un centre (C) et par une dimension caractéristique (d1, d2, d3); le procédé est caractérisé en ce que les zones d'impacts (I LC) sont disjointes, la distance (D I) entre chaque centre (C) des zones d'impact (I LC) étant égale à au moins dix fois la plus grande dimension caractéristique (d1, d2, d3) des zones d'impacts. L'invention concerne également un dispositif correspondant. Image

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