Method of adding particulate additives to metal particles

H - Electricity – 01 – F

Patent

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Details

H01F 1/00 (2006.01) B22F 1/00 (2006.01) B22F 1/02 (2006.01) H01F 1/053 (2006.01) H01F 1/057 (2006.01) H01F 1/06 (2006.01) H01F 1/20 (2006.01) H01F 1/26 (2006.01)

Patent

CA 2159674

Method of distributing and retaining insoluble additive particles uniformly throughout a mass of moldable metal particles. The additive particles are suspended in a solution of a polymeric binder and spray-coated onto the metal particles. When the solvent evaporates, the additives remain glued to the metal particles by the binder.

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