Method of an apparatus for sputtering

Details Method of an apparatus for sputtering Method of an apparatus for sputtering

C - Chemistry, Metallurgy

23

C

C23C 14/54 (2006.01) C03C 17/00 (2006.01) C03C 17/22 (2006.01) C03C 17/245 (2006.01) C03C 17/34 (2006.01) C23C 14/06 (2006.01) C23C 14/08 (2006.01) C23C 14/34 (2006.01) C23C 14/35 (2006.01) H01B 1/08 (2006.01) G02F 1/1343 (2006.01)

Patent

CA 2128981

A sputtering method comprises applying a negative voltage intermittently in a constant periodic cycle to a cathode disposed in a vacuum chamber, wherein the negative voltage is intermittently applied so that a time during which the negative voltage is not applied includes a time during which the voltage is controlled to be zero volt in a range of from 10 µs to 10 ms, and the zero voltage time is equal to or longer than the time required by one arcing from its generation to extinction.

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