B - Operations – Transporting – 05 – D
Patent
B - Operations, Transporting
05
D
B05D 1/26 (2006.01) B05C 5/02 (2006.01) B05C 11/02 (2006.01)
Patent
CA 2243388
A base plate coating method using a die coater. A base plate is placed on a support surface having a flatness of not more than 2 µm and a plurality of suction holes. The base plate is then sucked onto the support surface via the suction holes and thereby brought into close contact therewith. Consequently, the deformation (for example, torsion and flexure) of the base plate is eliminated. A coating liquid discharged vertically from a die coater is then applied to the base plate as the die coater is moved relatively to the base plate. As a result, a film of coating having a predetermined thickness is formed on the base plate.
L'invention concerne un procédé d'enduction d'une plaque de base au moyen d'un dispositif d'enduction par filière. Une plaque de base est placée sur une surface de support ayant une forme plate d'au plus 2 µm d'épaisseur et plusieurs orifices d'aspiration. La plaque de base est ensuite aspirée sur la surface de support par les orifices d'aspiration et mise ainsi en contact étroit avec celle-ci. Ainsi, on élimine la déformation (par exemple la torsion et la flexion) de la plaque de base. Un liquide d'enduction déchargé verticalement par un dispositif d'enduction à filière est ensuite appliqué sur la plaque de base à mesure que ledit dispositif se déplace par rapport à ladite plaque. On forme ainsi une pellicule d'enduction d'une épaisseur prédéterminée sur la plaque de base.
Nakamura Masahiro
Nishio Tsutomu
Yokoyama Takuya
Chugai Ro Co. Ltd.
Kirby Eades Gale Baker
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