Method of and apparatus for packaging chip components

Details Method of and apparatus for packaging chip components Method of and apparatus for packaging chip components

H - Electricity

01

L

356/143, 356/195

H01L 21/70 (2006.01) H05K 13/00 (2006.01)

Patent

CA 1247752

METHOD OF AND APPARATUS FOR PACKAGING CHIP COMPONENTS Abstract of the Disclosure A method of and an apparatus for loading chip components (13) orientation-specific into a carrier tape (3) that itself comprises a narrow strip of diaphanous material (1) having a series of depressions (7) embossed therein comprising the steps of moving a series of open-ended recesses, sized and shaped to receive a single chip component in a specific orientation, upwardly through a loose mass of chip components at a speed that is continually interrupted with real time pauses and ultimately transferring the chip components into conjunctive registry with the tape embossments.

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