Method of and device for placing chip-type electrical and/or...

Details Method of and device for placing chip-type electrical and/or... Method of and device for placing chip-type electrical and/or...

H - Electricity

01

L

356/122, 356/194

H01L 21/68 (2006.01) H05K 13/04 (2006.01)

Patent

CA 1204528

-13- ABSTRACT: "Method of and device for placing chip-type eleotrical and/or electronic components on a substrate". A method of and a device for placing chip type components on a substrate, in which a number of components are simultaneously picked up in presentation positions by means of a pick-up device which comprises a number of pick-up elements, after which the pick-up device is moved to a position over the substrate and each of the pick-up elements in succession is moved to a position over the desired position on the substrate by movement of the pick-up device and/or the substrate with respect to one another, after which the relevant component is deposited and released in the relevant position by the pick-up element.

425753

Affiliated with

Also associated with

Rating

Method of and device for placing chip-type electrical and/or... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of and device for placing chip-type electrical and/or..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of and device for placing chip-type electrical and/or... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1319905