Method of applying a curable resin to a substrate for use in...

G - Physics – 03 – F

Patent

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Details

G03F 7/16 (2006.01) B29C 35/10 (2006.01) B29C 39/18 (2006.01) B29C 39/20 (2006.01) B29C 41/12 (2006.01) B29C 41/20 (2006.01) B29C 41/22 (2006.01) D06N 7/00 (2006.01) D21F 7/08 (2006.01) D21F 11/00 (2006.01) B29C 35/08 (2006.01)

Patent

CA 2212175

The invention comprises a method for applying a curable resin, such as a photosensitive resin, to a substrate such as a papermaker's dewatering felt (220). The method comprises the steps of providing a substrate; providing a curable liquid resin; providing a second material different from the curable liquid resin; applying the second material (2410) to the substrate to occupy at least some of the voids in the substrate intermediate the first (230) and second (232) surfaces of the substrate; applying the curable resin (1520) to the substrate; curing (3150) at least some of the resin to provide a resin layer on the substrate; and removing (3170, 2550) at least some of the second material from the substrate, wherein at least some of the second material is removed from the substrate after applying the curable resin to the substrate.

L'invention porte sur une méthode d'application de résine durcissable, comme une résine photosensible, sur un subjectile, comme un feutre d'essorage de papetier (220). La méthode comprend les étapes pour fournir un subjectile; fournir une résine durcissable liquide; fournir un deuxième matériau différent de la résine durcissable liquide; appliquer le deuxième matériau (2410) sur le subjectile pour remplir au moins certains des vides dans le subjectile entre la première couche (230) et la deuxième couche (232) du subjectile; appliquer la résine durcissable (1520) sur le subjectile; faire durcir (3150) au moins une certaine quantité de résine pour obtenir une couche de résine sur le subjectile; et enlever (3170, 2550) au moins une certaine quantité du deuxième matériau sur le subjectile, où au moins une certaine quantité du deuxième matériau est retiré du subjectile après application de la résine sur le subjectile.

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