Method of applying a semi-rigid film to a substrate

Details Method of applying a semi-rigid film to a substrate Method of applying a semi-rigid film to a substrate

B - Operations, Transporting

29

C

B29C 63/02 (2006.01) B29C 63/00 (2006.01) B32B 17/10 (2006.01)

Patent

CA 2411593

A method of adhesively bonding an adhesive coated, semi-rigid film (80) to a substrate (32) is reported. The method utilizes at least two alignment tools (10) that are each positioned to substantially contact the surface of a substrate at an outer edge of the substrate. The adhesive-coated, semi-rigid film (80) is then interposed between the first and the second alignment tools (10) and the adhesive (84) is brought into contact with the major surface of the substrate (32). The semi-rigid film (80) is then aligned by contacting a first side edge of the semi-rigid film with a major surface of a first alignment tool and contacting a second side edge of the semi-rigid film with a major surface of a second alignment tool such that the film is aligned relative to the edge of the substrate. After alignment, pressure is applied to at least a portion of the surface area of the first side of the semi-rigid film to effectuate adhesive bonding of the film to the major surface of the substrate (32). Optionally, an application fluid may be provided between the adhesive layer (84) the semi-rigid film (80) to aid in positioning of the semi- rigid film.

Procédé servant à coller un feuil semi-rigide revêtu d'adhésif à un substrat. Ce procédé met en application au moins deux outils d'alignement placés chacun de façon à venir en contact avec la surface du substrat au niveau d'un bord extérieur de ce dernier. On intercale ensuite le feuil semi-rigide entre le premier et le deuxième outil d'alignement et on met en contact l'adhésif avec la surface principale du substrat. On aligne le feuil semi-rigide par mise en contact d'un premier bord latéral de ce feuil semi-rigide avec une surface principale du premier outil d'alignement et mise en contact d'un deuxième bord latéral du feuil semi-rigide avec une surface principale du deuxième outil d'alignement, de manière à aligner le feuil par rapport au bord du substrat. Après l'alignement, on exerce une pression sur au moins une partie de la surface du premier côté du feuil semi-rigide afin de coller ce feuil à la surface principale du substrat. On peut éventuellement utiliser un liquide d'application entre la couche adhésive du feuil semi-rigide afin de faciliter la mise en place de celui-ci.

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