Method of applying metallized contacts to a solar cell

Details Method of applying metallized contacts to a solar cell Method of applying metallized contacts to a solar cell

H - Electricity

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L

H01L 31/0224 (2006.01) H01L 21/60 (2006.01) H05K 1/00 (2006.01) H05K 3/12 (2006.01)

Patent

CA 2065871

2065871 9202952 PCTABS00010 A method of applying metallized contacts to the surfaces of semiconductor substrates (38) using a conventional pad printing device. Standard screen printing inks diluted 2-30 weight percent with an appropriate solvent have been satisfactorily used to accomplish the method. For certain contact configuration, portions of the surface of the substrate are covered with a Mylar mass (76) during the pad printing process. The method makes it possible to form a metallized contact (112) having a uniform thickness on an uneven substrate surface, e.g., the surface of a silicon substrate produced by EFG method.

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