Method of assembling a microcircuit with face-mounted leads

Details Method of assembling a microcircuit with face-mounted leads Method of assembling a microcircuit with face-mounted leads

H - Electricity

05

K

26/106

H05K 3/34 (2006.01) H01L 23/495 (2006.01)

Patent

CA 1096594

METHOD OF ASSEMBLING A MICROCIRCUIT WITH FACE-MOUNTED LEADS Abstract of the Disclosure A method of assembling a packaged microcircuit with face-mounted leads includes forming a lead frame into a holder with opposed sets of leads turned upward and angular to spaced apart carrier strips, and securing a substrate having a microcircuit thereon within the holder with one set of leads securely held in contact with terminals on a ace of the substrate, so that bonded electrical connections between the leads and the terminals can be readily made with conventional soldering techniques. The method can be employed to mass produce packaged micro- circuits with face-mounted leads.

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