Method of attaching electronic components

Details Method of attaching electronic components Method of attaching electronic components

H - Electricity

05

K

356/8

H05K 3/34 (2006.01) H05K 13/04 (2006.01) H05K 3/30 (2006.01)

Patent

CA 2018496

IMPROVED METHOD OF ATTACHING ELECTRONIC COMPONENTS Abstract of the Disclosure An improved method for double sided attachment of components to a printed circuit board is described wherein surface mount components soldered to a first surface of the circuit board (backside) are, once the board is inverted during reflow, retained in place only by force of molten solder surface tension.

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