Method of attaching elements by bonding

Details Method of attaching elements by bonding Method of attaching elements by bonding

B - Operations, Transporting

29

C

B29C 65/48 (2006.01) C09J 5/00 (2006.01)

Patent

CA 2747542

The present invention relates to a method of attaching a first portion and a second portion to each other, wherein the method comprises - exposing an adhesive for a low temperature in order to obtain a non--tacky adhesive, - arranging the non--tacky adhesive between the two portions, and - curing the adhesive. Further, the present invention relates to the use of adhesive according to the method.

La présente invention concerne un procédé permettant de fixer un premier élément à un deuxième élément, qui consiste à exposer un adhésif à une température réduite afin d'obtenir un adhésif non collant, disposer l'adhésif non collant entre les deux éléments, et durcir l'adhésif. L'invention concerne également l'utilisation d'un adhésif selon ce procédé.

Affiliated with

Also associated with

Rating

Method of attaching elements by bonding does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of attaching elements by bonding, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of attaching elements by bonding will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1854567