Method of attaching mold releasing agent to molding die,...

Details Method of attaching mold releasing agent to molding die,... Method of attaching mold releasing agent to molding die,...

B - Operations, Transporting

22

C

B22C 3/00 (2006.01) B22C 9/12 (2006.01) B22C 23/02 (2006.01)

Patent

CA 2354332

A method of attaching a mold releasing agent to a molding die, a molding apparatus and a molding die therefor are disclosed. A fixed die (11) of the molding die (1) is connected to the nozzle receiving surface of a molding cavity (10) facing a material supplying nozzle. The mold releasing agent is attached to the material contacting surface (100) of the molding die (1) in such a manner that the fixed die (11) and a movable die (12) are arranged in opposed relation to each other with a gap therebetween less than a distance which allows release of a molded product, and under this condition, the mold releasing agent is supplied to the material contacting surface (100) through the gap between the material supplying nozzle (31) and the nozzle receiving surface (131).

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