Method of bonding aromatic polyamide filamentary materials...

C - Chemistry – Metallurgy – 08 – J

Patent

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18/1018, 18/949

C08J 5/10 (2006.01) C08J 5/06 (2006.01)

Patent

CA 1037220

A B S T R A C T A method of bonding an aromatic polyamide filamentary material to a rubber composition comprising (1) applying an aqueous solution or dispersion of an epoxy resin to the filamentary material and drying the coated filamentary material (2) applying an aqueous dispersion of an elastomer and the constituents necessary to form a phenol- formaldehyde resin to the coated filamentary material and drying this coating and (3) assembling the coated filamentary material with a composition containing rubber and resin precursors and vulcanising said composition in contact with the coated filamentary material.

200449

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