Method of bonding electronic components

Details Method of bonding electronic components Method of bonding electronic components

B - Operations, Transporting

23

K

113/89, 26/90

B23K 1/20 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1187678

- 11 - METHOD OF BONDING ELECTRONIC COMPONENTS Abstract Disclosed is a method of bonding electronic components to metallized substrates by soldering. The solder is first deposited on an unmetallized substrate in a pattern of discrete pads corresponding to the leads of the components to be bonded. The component leads are then placed on the pads and the solder is reflowed. The solder thereby adheres to the leads so that a controlled amount of solder will remain on each lead when the component is lifted from the substrate. The components can then be soldered to an appropriate metallized substrate.

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