Method of bonding semiconductor devices to heatsinks

Details Method of bonding semiconductor devices to heatsinks Method of bonding semiconductor devices to heatsinks

B - Operations, Transporting

21

D

356/110, 356/173

B21D 39/00 (2006.01) B23K 20/02 (2006.01) H01L 21/603 (2006.01)

Patent

CA 1227887

METHOD OF BONDING SEMICONDUCTOR DEVICES TO HEATSINKS ABSTRACT OF THE DISCLOSURE A method for matching the bonding pad surfaces of a device and heatsinks to be bonded, which method maximizes the uniformity of pressure applied during thermocompression bonding, is disclosed. The method comprises using the collet of a die bonding machine to burnish the bonding pad on a heatsink. The collet is then traversed to a second workstage where the collet is used to pick up a device and burnish the device bonding pad against a suitable burnishing medium. The collet, with the device, is then traversed back to the main workstage where thermocompression bonding of the device to the heatsink is carried out. The alignment of the collet is locked and maintained throughout all of the steps to insure that all burnished surfaces are parallel and that the pressure during bonding is perfectly perpendicular to those parallel surfaces.

471970

Affiliated with

Also associated with

Rating

Method of bonding semiconductor devices to heatsinks does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of bonding semiconductor devices to heatsinks, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of bonding semiconductor devices to heatsinks will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1252741