H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/11
H05K 3/00 (2006.01) B23K 26/22 (2006.01) H01L 21/60 (2006.01) H05K 3/32 (2006.01)
Patent
CA 1135871
METHOD OF BONDING WIRES TO PASSIVATED CHIP MICROCIRCUIT CONDUCTORS Abstract A wire is positioned in intimate contact with a microcircuit hip above a conductor line or pad on the chip. The line is protected by a thin film layer of passivating or insulating material deposited upon the chip. A short pulse, focussed, energy source such as a laser beam drills a hole through or on the edge of the wire, and also opens a hole drawn through the insulating material to expose the conductor line. Then energy is directed upon the portion of the wire surrounding the hole to melt metal from the wire down into the hole which coalesces with molten metal below to form an electrical and mechanical bond of the wire to the line. YO978-042
336708
Chaudhari Praveen
Kiessling John B.
Perlman David J.
Tynan Eugene E.
von Gutfeld Robert J.
International Business Machines Corporation
Ogilvy Renault Llp/s.e.n.c.r.l.,s.r.l.
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