Method of bonding with water-based adhesives

B - Operations – Transporting – 29 – C

Patent

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Details

B29C 65/52 (2006.01) B05B 7/08 (2006.01) B05C 5/02 (2006.01) B05D 1/26 (2006.01) B05D 5/10 (2006.01)

Patent

CA 2051634

2051634 9014223 PCTABS00002 A method of bonding in which water-based adhesives, i.e., aqueous polymeric dispersions or emulsions, are extruded from the discharge outlet (26) of a dispensing device (10) as a bead (12) which is impinged by air jets (14) directed at an angle and tangent to the periphery of the bead. The viscosity of the water-based adhesive, hydraulic pressure at which the adhesive is extruded from the dispensing device, diameter of the discharge outlet and pressure of the air jets are controlled such that the extruded bead is attenuated by the air jets to form an elongated, thin adhesive strand or fiber (16) which is deposited in a spiral pattern (31) on a first substrate (32) for subsequent bonding to a second substrate.

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