Method of burnishing malleable films on semiconductor...

Details Method of burnishing malleable films on semiconductor... Method of burnishing malleable films on semiconductor...

H - Electricity

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356/178

H01L 21/463 (2006.01) B23K 20/24 (2006.01) B24B 39/06 (2006.01) H01L 21/768 (2006.01)

Patent

CA 1219383

RCA 80,414 METHOD OF BURNISHING MALLEABLE FILMS ON SEMICONDUCTOR SUBSTRATES ABSTRACT OF THE INVENTION An improved burnishing method suitable for planarizing bonding pads on fragile semiconductor devices is disclosed. The method comprises imparting scratches of predetermined depth and spacing onto a glass slide. The bonding pad surface is contacted to the scratched glass surface under a desired pressure and a relative motion is established therebetween. The motion is continued until a smooth, defect-free bonding pad surface has been provided.

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