Method of conforming a film to a surface

Details Method of conforming a film to a surface Method of conforming a film to a surface

B - Operations, Transporting

29

C

B29C 65/00 (2006.01) B26F 1/24 (2006.01) B29C 63/00 (2006.01) B29C 65/52 (2006.01) C09J 5/00 (2006.01) B29C 63/02 (2006.01)

Patent

CA 2471767

Methods of applying film to substrates are provided wherein the film matingly conforms to the configuration of the substrate, including areas adjacent protrusions or depressions in the substrate. In certain embodiments, the film is punctured by a probe and a vacuum is applied to the probe in order to aspirate air and urge the film toward a position of compliance with the substrate. Optionally, the film is softened by heat in order to facilitate conformance with the shape of the substrate.

Cette invention a trait à des procédés d'application de films sur des substrats permettant au film d'épouser parfaitement la configuration du substrat et, notamment, les régions du substrat présentant des saillants ou des creux. Dans certains modes de réalisation, le film est perforé par une sonde dans laquelle on crée une dépression pour aspirer l'air et forcer le film à s'adapter au substrat. Il est éventuellement possible d'amollir le film par chauffage afin de lui faire épouser plus facilement la forme du substrat.

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