Method of conforming an adherent film to a substrate by...

C - Chemistry – Metallurgy – 09 – J

Patent

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C09J 5/00 (2006.01) C04B 41/45 (2006.01) C04B 41/61 (2006.01) C09J 7/02 (2006.01) C23C 26/00 (2006.01)

Patent

CA 2488732

Films are closely conformed to substrates by reducing the air pressure to a subatmospheric level in at least one airflow pathway that is present in the film or the substrate. The reduced air pressure enables the film to tightly contact the substrate in locations where protrusions or depressions on the substrate are present. The method is particularly useful for conforming film containing graphics to a variety of substrates such as the sides of semi- trailers or concrete block walls, even in instances where the semi-trailer sides include rivets and/or grooves and where the concrete block wall is relatively rough.

Selon le mode de réalisation décrit dans la présente invention, des films sont étroitement ajustés sur des substrats par abaissement de la pression de l'air à un niveau de pression négative dans au moins un passage d'écoulement d'air ménagé dans le film ou dans le substrat. La pression de l'air ainsi abaissée permet au film d'entrer en contact étroit avec le substrat aux endroits où le substrat présente des protubérances ou des dépressions. Le procédé décrit dans cette invention est particulièrement utile pour ajuster un film contenant des éléments graphiques sur une large gamme de substrats, tels que les côtés de semi-remorques ou des murs de parpaing, y compris lorsque les côtés du semi-remorque sont dotés de rivets et/ou de rainures, et lorsque le mur de parpaing est relativement rugueux.

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