C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
6/4, 117/80
C23C 18/40 (2006.01) C23C 18/16 (2006.01)
Patent
CA 1331420
ABSTRACT OF THE DISCLOSURE Electroless metal plating solutions are formulated and controlled to provide high quality metal deposits by establishing the intrinsic cathodic reaction rate of the solution less than 110% of the intrinsic anodic reaction rate. Electroless copper plating solutions con- taining plating rate accelerators containing delocalized pi bonds and having the concentration of the reducing ager no greater than 1.2 times the concentration of t copper ion can deposit copper on printed wiring ?ards of quality sufficient to pass a thermal stress of 10 seconds contact with molten solder at 288 °C without cracking the copper deposits on the surface of the printed wiring boards or in the holes. As the plating solution ages by build up of plating reaction by-products or by-products and contamination, the quality of the copper deposited can be maintained by increasing the copper ion concentration and pH of the solution, while reducing or maintaining substantially constant the concentration of the reducing agent.
596926
Hughes Rowan
Paunovic Milan
Zeblisky Rudolph J.
Kollmorgen Corporation
Macrae & Co.
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