Method of controlling deposition amount distribution in a...

Details Method of controlling deposition amount distribution in a... Method of controlling deposition amount distribution in a...

C - Chemistry, Metallurgy

23

C

117/82

C23C 14/24 (2006.01) C23C 14/56 (2006.01)

Patent

CA 1249492

ABSTRACT OF THE DISCLOSURE In a continuous vacuum deposition plating of a metal strip, thinner coating at the edges can he prevented by maintaining the pressure of the deposition chamber in which an evaporation chamber is housed at a properly higher level than the pressure of the evaporation chamber.

482736

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