Method of creating detachable solder connections

Details Method of creating detachable solder connections Method of creating detachable solder connections

H - Electricity

01

R

H01R 4/02 (2006.01) H01L 21/60 (2006.01)

Patent

CA 2110782

A method is provided for creating solder connections between two surfaces which connections are relatively weak and thus can be readily fractured for separating the surfaces. The preferred application of the disclosed process is its use in connecting semiconductor chips to a carrier in order to conduct burn-in tests on the chips. The process consists of a series of steps to form a surface having a matrix of wettable and non-wettable areas on the pads of the carrier. Once the solder balls on the chip are attached to the treated pads on the carrier, electrical contacts are made and the chip can be readily removed after the test. The uniquely configured carrier can then be-reused numerous times for testing chips.

Affiliated with

Also associated with

Rating

Method of creating detachable solder connections does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of creating detachable solder connections, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of creating detachable solder connections will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1802825