Method of cutting a plastic functional film which is applied...

Details Method of cutting a plastic functional film which is applied... Method of cutting a plastic functional film which is applied...

B - Operations, Transporting

26

D

B26D 7/08 (2006.01) B26F 1/38 (2006.01) C03C 17/00 (2006.01)

Patent

CA 2532746

The invention relates to a method of cutting a plastic functional film, in particular a protective film, which has been applied to a hard substrate (6), such as a glass sheet. The invention is characterised in that the film is cut using an ultrasound cutting device having characteristics and parameters which are selected such that the cut is only made through the thickness of the functional film, leaving the underlying substrate intact.

Ce procédé de découpe d'un film fonctionnel en matière plastique, en particulier d'un film protecteur, à l'état appliqué sur un substrat dur (6), tel qu'une plaque de verre, est caractérisé par le fait qu'on réalise ladite découpe à l'aide d'un dispositif de découpe par ultra-sons, dont les caractéristiques et les paramètres ont été sélectionnés pour que la découpe ne soit effectuée que dans l'épaisseur du film fonctionnel en laissant intact le substrat sous-jacent.

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