Method of cutting an aperture in a device by means of a...

Details Method of cutting an aperture in a device by means of a... Method of cutting an aperture in a device by means of a...

B - Operations, Transporting

23

K

B23K 26/00 (2006.01) B23K 26/14 (2006.01)

Patent

CA 2092497

The invention relates to a method of cutting an aperture in a device (1) by means of a laser beam (9), said device comprising a wall (2) having first (5) and second (6) opposing surfaces, and a third surface (7) separated from said wall (2) along the path (11) of said laser beam (9), said method comprising the steps of: (a) causing said laser beam (9) to be incident upon said first surface (10) so as to cut through said wall (2) and form said aperture, and (b) introducing fluid between said second (6) and third (7) surfaces in the path (11) of said laser beam (9) so as to thereby prevent damage to said third surface (7) when said laser beam has cut through said wall. The invention may be used to cut aperture in devices such as injector nozzles syringe needles, medical stents and fluid/air control valves.

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