Method of cutting panels or stacks of panels and cutting...

B - Operations – Transporting – 26 – D

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

143/19

B26D 1/14 (2006.01) B23D 45/02 (2006.01) B27B 5/065 (2006.01) B27G 19/10 (2006.01)

Patent

CA 1268101

ABSTRACT OF THE DISCLOSURE A method of cutting panels or stacks of panels with a circular cutting saw to effect extremely neat and rapid cuts with no splintering. The saw cuts a panel in two steps, first by act- ing thereon through a portion of its thickness during a horizon- tal stroke, and then through the remaining portion of its thick- ness during the reverse stroke, while the direction of rotation of the saw remains unchanged and is such that the teeth thereof act successively on the two faces of the panel and press them inwardly of said panel. The saw is precisely adjustable both horizontally and vertically. Before being positioned for the first cutting step, it is displaced both vertically and horizon- tally to effect on the side of the panel where the cutting stroke is initiated and terminated one or more incisions compressing the panel material inwardly, thereby avoiding splintering during the subsequent cutting operations.

512903

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Method of cutting panels or stacks of panels and cutting... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of cutting panels or stacks of panels and cutting..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of cutting panels or stacks of panels and cutting... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1197771

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.