Method of depositing a silicon oxide film bonded to a...

C - Chemistry – Metallurgy – 23 – C

Patent

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C23C 16/40 (2006.01) C23C 16/02 (2006.01) C23C 16/50 (2006.01) C23C 16/503 (2006.01)

Patent

CA 2076029

L'invention concerne un procédé de dépôt d'une mince couche d'oxyde de silicium liée à un substrat en un matériau poly- mère comprenant, concomitamment ou successivement (1) la soumission d'une surface du substrat à une décharge électrique à barrière diélectrique et (2) l'exposition de ladite surface du substrat à une atmosphère contenant un silane, grâce à quoi il se forme un dépôt d'oxyde de silicium lié à ladite surface du substrat. Application à la production de feuilles ou pellicules utiles no- tamment comme emballage alimentaire.

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