Method of depositing a thick dielectric film

Details Method of depositing a thick dielectric film Method of depositing a thick dielectric film

H - Electricity

01

L

H01L 21/02 (2006.01) C23C 16/44 (2006.01) G02B 1/12 (2006.01) H01L 21/365 (2006.01)

Patent

CA 2369833

Thick dielectric films are deposited on a substrate by building up a plurality of layers by PECVD (Plasma Enhanced Chemical Vapor Deposition) in a reactor, each layer having a thickness less than the final thickness of the film to be deposited. The reactor is cleaned between the deposition of each layer. In this way, it is possible to form high quality, optical films.

Pellicules diélectriques épaisses faites de plusieurs couches déposées sur un substrat par dépôt chimique en phase vapeur activé par plasma, dans un réacteur. L'épaisseur de chaque couche est inférieure à l'épaisseur finale de la pellicule à déposer et le réacteur est nettoyé avant le dépôt de chaque nouvelle couche. De cette façon, il est possible de former des pellicules optiques de grande qualité.

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