Method of electroplating gold and gold plating baths...

Details Method of electroplating gold and gold plating baths... Method of electroplating gold and gold plating baths...

C - Chemistry, Metallurgy

25

D

204/29

C25D 3/48 (2006.01)

Patent

CA 1043734

METHOD OF ELECTROPLATING GOLD AND GOLD PLATING BATHS CONTAINING AMIDO-POLYPHOSPHATE ABSTRACT OF THE DISCLOSURE Disclosed is an aqueous composition suitable for plating gold deposits of improved brightness, and a method of plating therewith. An amido-polyphosphate compound is added to a plat- ing bath containing a gold complex, and the resulting deposits exhibit a substantial improvement in brightness. The visual quality of the deposits improves further by the additional in- clusion of a polyphosphate compound. Still further improve- ments may be obtained by the inclusion in a bath containing a gold cyanide complex of a small quantity of cobalt or nickel ion. In addition to improved brightness, the latter bath also exhibits improved hardness, an important characteristic for many applications.

224943

Affiliated with

Also associated with

Rating

Method of electroplating gold and gold plating baths... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of electroplating gold and gold plating baths..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of electroplating gold and gold plating baths... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1153941