Method of electroplating tin and alkaline electroplating...

Details Method of electroplating tin and alkaline electroplating... Method of electroplating tin and alkaline electroplating...

C - Chemistry, Metallurgy

25

D

204/27.5

C25D 3/56 (2006.01) C25D 3/60 (2006.01)

Patent

CA 1130755

ABSTRACT OF THE DISCLOSURE An improved electrotinplating process and electroplating bath therefor is disclosed. The electroplating bath contains tin ions, an alkali metal hydroxide, and a bismuth compound selected from the group consisting of at least one alkali metal bismuth salt of a linear polyhydroxymono- carboxylic acid having at least six carbon atoms, at least one alkali metal bismuthyl compound of glucono-delta-lactone, and mixtures thereof. The alkali metal bismuth compounds of this invention exhibit increased solubility and long-term stability in hot alkaline alkali metal stannate electroplating baths when compared to conventional alkali metal bismuthates. A preferred alkali metal bismuth compound is an alkali metal bismuthyl gluconate. An improved electrotinplating process is therefore provided which produces a plated tin-bismuth alloy which is resistant to the effects of tin pest.

326873

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