Method of encapsulating optoelectronic components

Details Method of encapsulating optoelectronic components Method of encapsulating optoelectronic components

G - Physics

02

B

G02B 6/13 (2006.01) H01L 33/52 (2010.01) B01J 13/02 (2006.01) H01L 31/0203 (2006.01) H01L 33/00 (2006.01) H01S 5/022 (2006.01) B32B 27/08 (2006.01)

Patent

CA 2663183

Method of encapsulating optoelectronic components, by embedding the components to be encapsulated between a first transparent polymer layer and a second polymer layer, which is filled with unactivated foaming agent, and then activating the foaming agent, so that the two polymer layers join to one another, in particular weld to one another, and the components are enclosed between the two polymer layers.

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