Method of establishing soldered connections

Details Method of establishing soldered connections Method of establishing soldered connections

H - Electricity

01

L

H01L 21/60 (2006.01) G02B 6/42 (2006.01) H01L 23/488 (2006.01) H01S 5/02 (2006.01)

Patent

CA 2077161

METHOD OF ESTABLISHING SOLDERED CONNECTIONS Abstract A method of connecting a component with regions of selective metallization to a reference surface comprises the steps of forming a desired pattern of wettable metal pads on the reference surface, depositing solder on each of the pads, and rigidly positioning the component on the reference surface. When the solder is heated, each of the solder patterns reflows and contacts a respective region of metallization on the component without movement of either the component or the reference surface.

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