C - Chemistry – Metallurgy – 09 – K
Patent
C - Chemistry, Metallurgy
09
K
149/10
C09K 13/00 (2006.01) C23F 1/02 (2006.01) H01J 9/14 (2006.01)
Patent
CA 1054905
ABSTRACT: A method of etching apertures in a thin metal foil. The foil is first covered on both sides with etchant-resistant layers which have the desir- ed pattern of apertures. One of the said layers is covered with a continuous protective layer. First, the side not covered with a protective layer is etched. The protective layer is then removed by means of a solvent, and then the other side is etched. According to the invention, the protective layer consists of a waxy hydrocarbon and the solvent consists of perchloroethylene. - 7 -
243150
LandOfFree
Method of etching apertures in a thin metal foil does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of etching apertures in a thin metal foil, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of etching apertures in a thin metal foil will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-543684