Method of etching apertures in a thin metal foil

C - Chemistry – Metallurgy – 09 – K

Patent

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C09K 13/00 (2006.01) C23F 1/02 (2006.01) H01J 9/14 (2006.01)

Patent

CA 1054905

ABSTRACT: A method of etching apertures in a thin metal foil. The foil is first covered on both sides with etchant-resistant layers which have the desir- ed pattern of apertures. One of the said layers is covered with a continuous protective layer. First, the side not covered with a protective layer is etched. The protective layer is then removed by means of a solvent, and then the other side is etched. According to the invention, the protective layer consists of a waxy hydrocarbon and the solvent consists of perchloroethylene. - 7 -

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