B - Operations – Transporting – 26 – F
Patent
B - Operations, Transporting
26
F
149/6
B26F 3/00 (2006.01) C08J 7/12 (2006.01) H01L 21/311 (2006.01) H05K 1/03 (2006.01) H05K 3/00 (2006.01)
Patent
CA 1155736
ABSTRACT OF THE DISCLOSURE METHOD OF ETCHING POLYIMIDE In etching openings in polyimide film, the film is first etched with a basic reagent in its uncured or partially cured state to form the desired open- ings, and thereafter, the film is cured. However, this will leave a layer of disturbed material surrounding the openings which has absorbed some reagent and will not fully cure and, therefore, not provide topography suitable for reliable inter- connection and metal adherence. This disturbed material is removed by a second etch in a basic reagent, following additional curing to a sufficient extent to prevent any etching of the polyimide free of absorbed etchant. Thereby, suitable topography and adherence is provided. BU-9-81-018
407334
Fineman Jonathan P.
Kieny Leonard A. Jr.
International Business Machines Corporation
Saunders Raymond H.
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