Method of forming a bussing block

Details Method of forming a bussing block Method of forming a bussing block

H - Electricity

01

R

339/18, 347/32

H01R 31/08 (2006.01) H01R 9/22 (2006.01)

Patent

CA 1231404

ABSTRACT A method of forming a bussing block having wafers stacked one on top of the other and including apertures which are in alignment with each other. Buss bars are carried on the wafers and have apertures aligned with the apertures in the wafers. Electrically insulating collars extend from selected ones of the wafer apertures so that when electrical terminals are inserted through all of the aligned apertures of the wafers and buss bars, the electrical terminals will be electrically isolated from the buss bars by the collars.

465622

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