H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/46 (2006.01) G03F 7/027 (2006.01) G03F 7/028 (2006.01) G03F 7/09 (2006.01) G03F 7/16 (2006.01) G03F 7/26 (2006.01) H05K 1/02 (2006.01) H05K 1/14 (2006.01) H05K 3/06 (2006.01) G03F 7/038 (2006.01) H05K 3/00 (2006.01)
Patent
CA 2090099
In a process for fabricating a multilayer printed circuit board with permanent innerlayers of photoresist, the photo- imageable composition used to form the hard permanent layer comprises a polymerizable acrylate monomer; an oligomer formed by the reaction of an epoxy resin and an acrylic or methacrylic acid; a photosensitive, free radical generating initiator for polymerization of the acrylic monomer and oligomer; a curable epoxy resin; a curing agent for the epoxy resin; and, optionally, a crosslinking agent reactive with hydroxyl groups. After exposure and development of a layer of the photoimageable composition and etching of the underlying metal layer on a board, the resultant photoresist is left on the circuitry traces. The innerlayers of photoresist are stacked in a press where it initially conforms under heat and pressure to fill voids between the innerlayers and then cures to permanence.
Flynn Kathy M.
Rath James
Tara Vinai Ming
Tran William Luong-Gia
Gowling Lafleur Henderson Llp
Rohm And Haas Chemicals Llc
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